1. Overview of Equipment and Application Fields

The IC8000-S Temperature-Controlled Coating Machine is a high-end intelligent spin coating system specifically engineered to address challenges in coating high-viscosity materials and special thermal-assisted processes. The model designation "IC8000" signifies its Integrated Control (IC) and 8-inch processing capacity, while the "S" denotes the Smart Heating (SH) core technology. This device innovatively integrates a high-precision servo motor drive system with an embedded PID temperature control module, achieving not only precise speed regulation but also real-time, uniform temperature control during spin coating (operating from room temperature to 200°C or higher). Through preheating with a heating plate, dynamic heating, or gradient temperature control, the IC8000-S effectively reduces the viscosity of high-viscosity photoresists, sol-gel precursors, and polymer solutions, improving their flowability and wettability. This significantly enhances film uniformity, density, substrate adhesion, and minimizes pinhole defects. Equipped with a 7-inch full-color touchscreen and industrial-grade PLC, the system supports multi-stage programming for temperature and speed coordination. Widely applied in thick-film photoresist coating, SU-8 lithography, ferroelectric/piezoelectric ceramic films, organic semiconductors, perovskite solar cells, and thermal-assisted nanofunctional material fabrication, this equipment serves as a powerful tool for universities, research institutes, and corporate R&D centers to overcome complex film processing challenges.

2. Core Functional Highlights

· Dual-core Coordinated Control of Servo Drive and Intelligent Temperature Control

o High-precision servo motor: Featuring imported servo motors with a speed range of 100-8000 rpm and ±1 rpm accuracy, it delivers acceleration up to 50,000 rpm/s, ensuring outstanding stability in basic spin coating performance.

o Embedded PID temperature control: The vacuum suction cup incorporates high-quality heating elements and high-sensitivity temperature sensors, working in tandem with PID algorithms to achieve precise temperature control across a wide range from room temperature to 200°C (up to 300°C optional), with an accuracy of ±0.5°C.

o Temperature uniformity: The innovative heating plate design with optional hot air assistance ensures a surface temperature variation of less than ±1.5℃ for 8-inch wafers, effectively preventing film thickness streaks or stress concentration caused by temperature irregularities.

· Complex thermal assisted process programming capability

o Multi-stage coordinated control: Supports three-dimensional programming of temperature-speed-time linkage. Users can set complex process curves such as "preheating stage (static heating)", "low-speed spreading stage (dynamic heating)", "high-speed glue ejection stage (constant temperature/cooling)", and "in-situ soft baking stage".

o Extensive recipe storage: Featuring 100 built-in process programs, each supporting up to 50 steps, it accurately records and reproduces various thermal-assisted adhesive application techniques, ensuring high reproducibility of experimental results.

o Real-time curve monitoring: The 7-inch touchscreen displays rotational speed curves and temperature change curves in real time, enabling researchers to analyze process parameters and optimize them.

· Optimization Design of High Viscosity Materials

o Efficient heat transfer: A specially designed high-conductivity vacuum suction cup ensures rapid and uniform heat transfer to the substrate, enabling even thick glass or silicon wafers to reach the set temperature quickly.

o Anti-adhesion treatment: The suction cup surface is coated with a special anti-adhesion layer, allowing easy removal of substrates even when coated with high-viscosity adhesive under high temperatures, with no residue.

o Automatic dispensing compatibility: Features standard 4-channel dispensing with preheated substrate support, preventing instant solidification or uneven leveling of adhesive on cold substrates.

· Durable, Secure, and Flexible Expansion

o Heat-resistant and solvent-resistant chamber: The interior is made of modified HDPE or PFA, with a heat-resistant PC top cover that resists both organic solvent corrosion and long-term high-temperature deformation.

o Multi-level safety protection: Features over-temperature alarm with power-off, heating element overcurrent protection, thermocouple circuit-breaker detection, cover-open shutdown, and anti-scald warning.

o Glove box compatibility: Compact structural design supports glove box integration, enabling high-temperature spin coating under inert gas protection to meet the requirements for sensitive material preparation.

o Optional features: The system supports optional edge-bonding adhesive (EBR), back cleaning, and in-situ infrared drying modules, delivering a one-stop thermal-assisted adhesive application solution.

3. Technical Parameters and Specifications

² The temperature control range of the rotary heater is from room temperature to 200℃.

² Temperature resolution: 0.1℃;

² Temperature control accuracy: <±0.5℃ (after stabilization);

² Temperature uniformity of the rotary table: <±2%;

² RPM range: 100-8000;

² Rotation speed resolution: ±1 rpm;

² The acceleration is adjustable from 100 to 5000 rpm/s.

² Maximum single-step spin coating duration: 3000 seconds;

² Time resolution: 0.1s;

² Supports up to 100 sets of 100-step programs with expandable functionality.

² The standard adjustable clamp tray features 10-35mm round plates, with other specifications available for customization.

4. Typical Application Scenarios

· Thick-film photoresist process: Apply high-viscosity thick resists such as SU-8 and AZ series, then heat them to reduce viscosity, resulting in a uniform, bubble-free thick film for deep reactive ion etching (DRIE) of MEMS masks.

· The sol-gel precursor films of PZT and BST were prepared by the sol-gel method. The thermal-assisted coating can promote the evaporation of solvent and the initial crystallization, and improve the density and electrical properties of the films.

· Organic Electronics and Photovoltaics: Coating PEDOT with PSS, organic small molecules, and perovskite precursors to precisely control crystallization kinetics and optimize device efficiency.

· High-adhesion coating: For hard-wet substrates (e.g., certain metals or hydrophobic surfaces), heating the substrate significantly improves adhesive wetting and enhances film adhesion.

· Rapid prototyping: The integrated process of "gluing-in-place soft baking" shortens the process cycle and accelerates the R&D and validation of new materials and devices.

· Special polymer films: Processing polymer solutions with high glass transition temperature (Tg) requires maintaining fluidity at high temperatures to form uniform films.

5. Why choose the temperature-controlled homogenizer IC8000-S?

The temperature-controlled gel homogenizer IC8000-S is the ultimate solution for coating high-viscosity materials and thermal-assisted film formation processes. More than just a gel homogenizer, it is an intelligent reaction platform integrating precision temperature control and servo drive. With ±0.5℃ temperature accuracy and temperature-speed linkage programming, researchers can precisely control solution rheology and film formation kinetics, effortlessly overcoming challenges like uneven film thickness, pinholes, and poor adhesion that traditional ambient gel homogenizers cannot resolve. Whether processing expensive specialty photoresists or developing new functional films, the IC8000-S delivers exceptional repeatability, flexible process adaptability, and high safety, helping you break through technical bottlenecks and produce high-quality research outcomes. Choosing the IC8000-S means choosing the professional benchmark in thermal-assisted film preparation, ensuring every spin-coating process is precisely controllable and flawless.